Lithographic process in which the exposed region of
resist is silylated and the
image then formed through reactive oxygen
etch.
Notes: - Usually a chemically amplified photoresist is used.
- Oxygen plasma is used to convert any silicon to \(\ce{SiO2}\).
Source: PAC, 2020,
92, 1861. (
Terminology of polymers in advanced lithography (IUPAC Recommendations 2020)) on page 1889 [
Terms] [
Paper]