{"term":{"id":"09581","title":"top-surface imaging","longtitle":"IUPAC Gold Book - top-surface imaging","doi":"10.1351\/goldbook.09581","code":"09581","status":"current","initialism":"<em>initialism<\/em>: TSI","definitions":[{"id":1,"text":"Lithographic process in which the exposed region of resist is silylated and the image then formed through reactive oxygen etch.","notes":{"1":"Usually a chemically amplified photoresist is used.","2":"Oxygen plasma is used to convert any silicon to \\(\\ce{SiO2}\\)."},"links":[{"term":"etch","url":"https:\/\/goldbook.iupac.org\/\/terms\/view\/09488"},{"term":"image","url":"https:\/\/goldbook.iupac.org\/\/terms\/view\/09495"},{"term":"resist","url":"https:\/\/goldbook.iupac.org\/\/terms\/view\/09564"}],"sources":["PAC, 2020, 92, 1861. 'Terminology of polymers in advanced lithography (IUPAC Recommendations 2020)' on page 1889 (https:\/\/doi.org\/10.1515\/pac-2018-1215)"]}],"altoutputs":{"html":"https:\/\/goldbook.iupac.org\/terms\/view\/09581\/html","xml":"https:\/\/goldbook.iupac.org\/terms\/view\/09581\/xml","plain":"https:\/\/goldbook.iupac.org\/terms\/view\/09581\/plain"},"citation":"Citation: 'top-surface imaging' in IUPAC Compendium of Chemical Terminology, 5th ed. International Union of Pure and Applied Chemistry; 2025. Online version 5.0.0, 2025. 10.1351\/goldbook.09581","license":"The IUPAC Gold Book is licensed under Creative Commons Attribution-ShareAlike CC BY-SA 4.0 International (https:\/\/creativecommons.org\/licenses\/by-sa\/4.0\/) for individual terms.","collection":"If you are interested in licensing the Gold Book for commercial use, please contact the IUPAC Executive Director at executivedirector@iupac.org .","disclaimer":"The International Union of Pure and Applied Chemistry (IUPAC) is continuously reviewing and, where needed, updating terms in the Compendium of Chemical Terminology (the IUPAC Gold Book). Users of these terms are encouraged to include the version of a term with its use and to check regularly for updates to term definitions that you are using.","accessed":"2026-08-05T21:18:35+00:00"}}