Lithographic process in which the exposed region of
resist is silylated and the
image then formed through reactive oxygen
etch.
Notes: - Usually a chemically amplified photoresist is used.
- Oxygen plasma is used to convert any silicon to \(\ce{SiO2}\).
Source:
PAC, 2020, 92, 1861. 'Terminology of polymers in advanced lithography (IUPAC Recommendations 2020)' on page 1889 (https://doi.org/10.1515/pac-2018-1215)