The ratio of @C01452@ at a point X on an @I03082@ to the @A00539@ (\(\frac{j_{\text{x}}}{j}\)) is called the @R05268@. The current distribution is described by the function \(\frac{j_{\text{x}}}{j} = f(x)\) (or more generally, \(\frac{j_{\text{x}}}{j} = f(x,\,y,\,z)\) where \(x\) or \((x,\,y,\,z)\) are the coordinates of the points of the electrode-solution @I03082@. The @P04828@ is that which establishes itself when the influence of @O04358@ is negligible. The @S05516@ is that which establishes itself when the influence of the @O04358@ cannot be neglected but @C01230@ is negligible. The secondary distribution is often described in terms of dimensionless numbers of the form \[\mathrm{Wa}=\frac{\kappa }{l}\ \frac{\mathrm{d}\eta }{\mathrm{d}j}\] where \(\kappa \) is the @C01245@ of the solution, \(\frac{\text{d}\eta }{\text{d}j}\) the slope of the @O04358@-current curve under the above conditions and \(l\) a characteristic length of the system, for instance the radius of a disc electrode. \(\mathrm{Wa}\) is the @W06652@. It is a quantity which determines the @T06370@ and characterizes the equalizing influence of @O04358@ on the current distribution. In electroplating the @T06370@ is qualitatively defined as 'the ability of a solution to deposit metal uniformly upon a @C00905@ of irregular shape'. The @T06281@ is that which establishes itself when the influence of the @O04358@ (including @C01230@) cannot be neglected.