https://doi.org/10.1351/goldbook.08893
Polymers composed of macromolecules containing cyclic dicarboximide groupings in the backbone:
where \(\ce{R^{1}}\), \(\ce{R^{2}}\), \(\ce{R^{3}}\) and \(\ce{R^{4}}\) are groups with connectivity one, two, three, and four, respectively (structure-based polymer class name).
Note:
In electronics, polyimides are mainly used as highly flexible insulating and passivation layers in integrated circuits and microelectronic chips.
In electronics, polyimides are mainly used as highly flexible insulating and passivation layers in integrated circuits and microelectronic chips.
Example:
