Short, low temperature
annealing step following the coating of a wafer with a photoresist.
Note: The purpose of the soft bake is to (1) drive out remaining coating solvent from the
resist layer; (2) improve the adhesion of the
resist to the substrate; and (3) anneal the shear stresses introduced during spin-coating.
Source: PAC, 2020,
92, 1861. (
Terminology of polymers in advanced lithography (IUPAC Recommendations 2020)) on page 1888 [
Terms] [
Paper]