Method whereby a film, usually metallic, deposited on a patterned substrate after
etch processing, is removed during
resist strip, which leaves only that portion of the film that is deposited directly onto the exposed regions of the substrate.
Note: A lift-off process is commonly employed to pattern substrates when using
resists that have little or no
dry-etch resistance.
Source:
PAC, 2020, 92, 1861. 'Terminology of polymers in advanced lithography (IUPAC Recommendations 2020)' on page 1876 (https://doi.org/10.1515/pac-2018-1215)