Facility of an exposed
resist to withstand etching conditions, usually a plasma, determined in comparison to a reference standard.
Note: Plasma may be oxygen or halogen-based.
Source:
PAC, 2020, 92, 1861. 'Terminology of polymers in advanced lithography (IUPAC Recommendations 2020)' on page 1873 (https://doi.org/10.1515/pac-2018-1215)